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From Bigger to Better: How Vishay eSMP and DFN Drive Automotive Downsizing
The push toward electrification, connectivity, and higher system integration is transforming the automotive industry. As vehicles become smarter and more compact, engineers face unprecedented pressure to reduce PCB footprint while maintaining – or even enhancing – electrical and thermal performance. This is where downsizing becomes more than just a design goal — it’s a competitive necessity.
Join our webinar,
“From Bigger to Better: How Vishay eSMP® and DFN Drive Automotive Downsizing,”
to discover how Vishay’s latest eSMP® and DFN diode packages enable higher power density, improved heat dissipation, and long-term reliability in space-constrained automotive designs.
“From Bigger to Better: How Vishay eSMP® and DFN Drive Automotive Downsizing,”
to discover how Vishay’s latest eSMP® and DFN diode packages enable higher power density, improved heat dissipation, and long-term reliability in space-constrained automotive designs.
Together with our partner Vishay, we’ll explore:
• Why downsizing is reshaping automotive electronics – from ECUs to EV power modules
• How eSMP® and DFN packages overcome the limits of traditional housings like SOT-23 or SMB
• Real-world applications such as motor control, ESD protection, lighting, and EV power systems
• How standardizing on these modern footprints simplifies design and boosts performance
• How eSMP® and DFN packages overcome the limits of traditional housings like SOT-23 or SMB
• Real-world applications such as motor control, ESD protection, lighting, and EV power systems
• How standardizing on these modern footprints simplifies design and boosts performance
Stay ahead of the curve and see how smaller can truly mean better in next-generation automotive electronics.
